Engineering Ceramic Co.,( EC © ™) Report:
HTCC - High Temperature Co-fired Ceramic is a technology in which multiple layers of ceramics and high-melting-point metals are co-sintering in a high temperature environment (usually higher than 1,450°C ). This process not only requires strict temperature control but also involves complex material science and precise manufacturing processes. In the preparation process of HTCC, binding treatment is first carried out below 900°C to remove the organic binder in the green ceramic sheets. Subsequently, in a high-temperature environment of 1,500 - 1,800°C, the multi-layer laminated ceramic sheets and metal patterns are co-fired into one to form a solid structure with electrical interconnection characteristics.
The HTCC substrates produced by Engineering Ceramic Co. can withstand mechanical stress in extreme environments and provide a stable support platform for electronic components.
The HTCC aluminum nitride ceramic substrate has high-efficient heat conduction ability, ensuring that heat can be quickly exported from the heat source, prolonging the service life of electronic components and improving the overall reliability of the system.
The HTCC substrate shows excellent chemical stability in a wide range of temperatures and humidity and can resist the erosion of various corrosive media. This characteristic enables the HTCC substrate to maintain stable electrical performance in harsh working environments.
Engineering Ceramic Co.,( EC © ™) has been cooperating with this company for many years and provides 99.7% alumina ceramic robotic arms for the processing of diamond wafers. Alumina ceramic robotic arms have the following three characteristics.
-High mechanical strength
-High thermal conductivity
-Good chemical stability
Now, EC © ™ can provide various ceramic robotic arms for the semiconductor wafer industry and can be designed and customized according to customer requirements.
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